Title:
MULTI-LAYER FILM, AND MULTI-LAYER STRUCTURE USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/120642
Kind Code:
A1
Abstract:
Provided is a multi-layer film which has a layer (X) serving as the outermost layer and in which at least the layer (X), a layer (Y), and a layer (Z) are laminated adjacent to each other in this order, wherein: the layer (X) comprises a resin composition (A) that contains, as the main component thereof, a modified ethylene-vinyl alcohol copolymer (a) which has been modified by an epoxy compound and the melting point of which is not less than 110°C but less than 150°C; the layer (Y) contains, as the main component thereof, an adhesive resin (B), the melting point of which is less than 150°C; the layer (Z) contains, as the main component thereof, a polyethylene resin (C), the melting point of which is less than 150°C; and the resin composition (A) contains 20-1,500 ppm of alkali metal ions (b). This multi-layer film is excellent in terms of external appearance, interlayer adhesiveness, gas barrier properties, and blocking resistance, even while having as the outermost layer thereof a modified EVOH that has been modified with an epoxy compound.
Inventors:
KITAMURA MASAHIRO (BE)
MURAMOTO TAKUYA (JP)
YOSHIDA KENTARO (JP)
MURAMOTO TAKUYA (JP)
YOSHIDA KENTARO (JP)
Application Number:
PCT/JP2022/047364
Publication Date:
June 29, 2023
Filing Date:
December 22, 2022
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
B32B27/28; B29B17/04; B29C48/00; B29C55/04; B29C55/12; B32B27/32; B65D65/40
Domestic Patent References:
| WO2021210606A1 | 2021-10-21 | |||
| WO2020196568A1 | 2020-10-01 | |||
| WO2020184523A1 | 2020-09-17 | |||
| WO2020071513A1 | 2020-04-09 | |||
| WO2021261560A1 | 2021-12-30 |
Foreign References:
| JP2021102763A | 2021-07-15 |
Attorney, Agent or Firm:
SETOUCHI INTERNATIONAL PATENT FIRM (JP)
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