Title:
MULTI-LAYER FOCUS RING FOR PLASMA SEMICONDUCTOR PROCESSING
Document Type and Number:
WIPO Patent Application WO/2024/040526
Kind Code:
A1
Abstract:
The present disclosure generally relates to plasma semiconductor processes and related components and tools. In an example, a focus ring includes first and second ring layers. An upper surface of the second ring layer is configured to support the first ring layer by a lower surface of the first ring layer contacting the upper surface. The lower and upper surfaces are periodic circumferentially and have a same period length. At least one of the lower and upper surfaces includes a first protrusion radial line (PRL), a second PRL, and a recess radial line (RRL) disposed between the first and second PRLs. The period length is from the first PRL to the second PRL. The lower and/or upper surface from the first PRL to the RRL is continuous and from the RRL to the second PRL is continuous. The second ring layer is rotatably movable relative to the first ring layer.
Inventors:
PENG YULIN (CN)
ZHAO JINRONG (CN)
ZHAO JINRONG (CN)
Application Number:
PCT/CN2022/114863
Publication Date:
February 29, 2024
Filing Date:
August 25, 2022
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
H01J37/21; H01J37/02
Foreign References:
| CN103247507A | 2013-08-14 | |||
| CN101488468A | 2009-07-22 | |||
| JP2009010017A | 2009-01-15 | |||
| US20030000459A1 | 2003-01-02 |
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
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