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Patent Searching and Data


Title:
MULTI-LAYER MICRONEEDLE STRUCTURE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2022/003653
Kind Code:
A1
Abstract:
A multi-layer microneedle structure and a method for manufacturing same are provided. The multi-layer microneedle structure according to an embodiment of the present invention includes: a base layer formed on a support; a core layer formed on the base layer and containing a drug; and a shell layer formed to cover the core layer on the base layer. Herein, the relationship between the thickness (T) of the shell layer outside the core layer and the height (H2) of the core layer is determined according to the material constituting the core layer.

Inventors:
JUNG HYUNG IL (KR)
YOU JEONG YUN (KR)
Application Number:
PCT/IB2021/056002
Publication Date:
January 06, 2022
Filing Date:
July 05, 2021
Export Citation:
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Assignee:
UNIV YONSEI IACF (KR)
International Classes:
A61M37/00
Domestic Patent References:
WO2014197995A12014-12-18
Foreign References:
KR20160073337A2016-06-24
KR20170008183A2017-01-23
KR20120068516A2012-06-27
US20190183405A12019-06-20
KR20190123642A2019-11-01
Attorney, Agent or Firm:
ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)
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