Title:
MULTI-LAYER RESIN SHEET, AND MOULDED CONTAINER OBTAINED BY MOULDING SAME
Document Type and Number:
WIPO Patent Application WO/2022/131246
Kind Code:
A1
Abstract:
[Problem] To provide a thermally mouldable, rigid multi-layer resin sheet which has oxygen barrier properties and can be given the property of being notch-bendable following thermal moulding, and to provide a deep-drawn moulded container which has excellent designability and visual perceptibility. [Solution] A multi-layer resin sheet which includes an oxygen-barrier resin layer and styrene resin layers C and D which are respectively stacked on the two sides of the oxygen-barrier resin layer with modified olefin polymer layers A and B in between, characterised in that: the total thickness is 500 to 1200 μm; the thickness of the styrene resin layer C is 10 to 35% of the total thickness; the thickness of the styrene resin layer D is 50 to 80% of the total thickness; the surface roughness (Ra) of the surfaces of the styrene resin layers C and D on the reverse side from the surfaces facing the modified olefin polymer layers A and B is 0.1 to 2.0 μm; the styrene resin layer D includes 15 to 70 mass% of a styrene/conjugated diene block copolymer and 30 to 85 mass% of a polystyrene containing 0.5 to 5 mass% of a conjugated diene rubber onto which styrene monomers have been grafted.
Inventors:
OGAWA YUDAI (JP)
NAKAZATO TOSHIKATSU (JP)
NAGANO TOSHIO (JP)
NAKAZATO TOSHIKATSU (JP)
NAGANO TOSHIO (JP)
Application Number:
PCT/JP2021/046021
Publication Date:
June 23, 2022
Filing Date:
December 14, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B32B27/00; B32B27/30; B65D1/00; B65D1/30; C08L25/06; C08L51/04; C08L53/00
Domestic Patent References:
| WO2014129344A1 | 2014-08-28 | |||
| WO2017221374A1 | 2017-12-28 | |||
| WO2014087696A1 | 2014-06-12 | |||
| WO2018116504A1 | 2018-06-28 |
Foreign References:
| JP2008213355A | 2008-09-18 | |||
| JP2020121505A | 2020-08-13 | |||
| JP2017171770A | 2017-09-28 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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