Title:
MULTI-LAYER STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2022/113652
Kind Code:
A1
Abstract:
This multi-layer structure has a support, a resin layer laminated on the support with an adhesive layer therebetween, and a glass layer laminated on the resin layer, wherein: the thickness of the glass layer is 10 μm to 300 μm; and when the linear expansion coefficient of the support is CTE [ppm/°C], the thickness of the adhesive layer is d [μm], the elastic modulus of the adhesive layer is E [GPa], and a = CTE/(d/E), the value of a being at most 3.
Inventors:
INAGAKI JUNICHI (JP)
SATO KEISUKE (JP)
MURASHIGE TAKESHI (JP)
SATO KEISUKE (JP)
MURASHIGE TAKESHI (JP)
Application Number:
PCT/JP2021/040086
Publication Date:
June 02, 2022
Filing Date:
October 29, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B17/10
Domestic Patent References:
| WO2019087938A1 | 2019-05-09 | |||
| WO2018190208A1 | 2018-10-18 | |||
| WO2017135261A1 | 2017-08-10 | |||
| WO2020013012A1 | 2020-01-16 |
Foreign References:
| JP2017024386A | 2017-02-02 | |||
| JP2015101044A | 2015-06-04 | |||
| JP2013231744A | 2013-11-14 | |||
| JP2020196632A | 2020-12-10 |
Other References:
See also references of EP 4253042A4
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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