Title:
MULTI-LAYER STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/163129
Kind Code:
A1
Abstract:
This multi-layer structure comprises a metal support, an adhesive layer overlaid on the support, a metal layer overlaid on the adhesive layer, and a glass layer overlaid on the metal layer. The glass layer has a thickness between 10 µm and 300 µm both inclusive.
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Inventors:
MURASHIGE TAKESHI (JP)
HINO TAKAFUMI (JP)
HINO TAKAFUMI (JP)
Application Number:
PCT/JP2023/006841
Publication Date:
August 31, 2023
Filing Date:
February 24, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B32B15/04; B32B15/08; B32B17/06; C03C17/09; C03C27/04; G02B5/08
Domestic Patent References:
| WO2012056952A1 | 2012-05-03 | |||
| WO2012023347A1 | 2012-02-23 | |||
| WO2021199987A1 | 2021-10-07 | |||
| WO2022113652A1 | 2022-06-02 |
Foreign References:
| JP2012137579A | 2012-07-19 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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