Title:
MULTI-LAYER WIRING BOARD HAVING LC RESONANCE CIRCUIT, AND ELECTRONIC COMPONENT PACKAGE USING MULTI-LAYER WIRING BOARD HAVING LC RESONANCE CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2020/255791
Kind Code:
A1
Abstract:
Provided are a multi-layer wiring board having an LC resonance circuit exhibiting an enhanced resonance characteristic and an enhanced signal attenuation characteristic, and an electronic component package using the multi-layer wiring board having the LC resonance circuit. For this purpose, the multi-layer wiring board having the LC resonance circuit with conductive layers and insulating resin layers being alternately stacked on both surfaces of a core board is provided with: a first set of wires constituting both ends of the LC resonance circuit and formed in a first one of the conductive layers; a set of vias penetrating the insulating resin layers; and a second set of wires connected to the input/output terminals of the LC resonance circuit and formed in a second one of the conductive layers, wherein the first set of wires are connected to the second set of wires by way of the set of vias.
Inventors:
KANOU NORIKO (JP)
MANIWA SUSUMU (JP)
MANIWA SUSUMU (JP)
Application Number:
PCT/JP2020/022662
Publication Date:
December 24, 2020
Filing Date:
June 09, 2020
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
H03H7/075; H05K1/16; H05K3/46
Foreign References:
| JPH08250962A | 1996-09-27 | |||
| JP2019083282A | 2019-05-30 | |||
| JP2019507972A | 2019-03-22 | |||
| JP2007142109A | 2007-06-07 | |||
| JP2018099705A | 2018-06-28 |
Other References:
See also references of EP 3989440A4
Attorney, Agent or Firm:
PATENT CORPORATE BODY DAI-ICHI KOKUSAI TOKKYO JIMUSHO (JP)
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