MULTI-LAYER WIRING BOARD, MANUFACTURING METHOD FOR SAME, AND PROBE-CARD-USE SUBSTRATE

WIPO Patent Application WO/2014/174710

A1

The present invention achieves a multi-layer wiring board which can achieve high density for a wiring structure. Provided is a multi-layer wiring board (1) wherein: printed wiring electrodes (7, 11) are provided within a laminate (2), which has a first insulating layer (3) and a second insulating layer (4) which is laminated on a lower surface of the first insulating layer (3); the printed wiring electrodes (7, 11) are formed by printing and sintering of a conductive paste; and the printed wiring electrodes (7, 11) have respective first wiring electrode portions (7a, 11a) which are positioned upon the second insulating layer (4), and respective second wiring electrode portions (7b, 11b) which are in continuation with the respective first wiring electrode portions (7a, 11a), said second wiring electrode portions (7b, 11b) extending to within respective through-holes (3a, 3b), and being exposed on the top surface of the first insulating layer (3).

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OTSUBO YOSHIHITO (JP)
MEGURO TORU (JP)
KAN TATSUNORI (JP)

PCT/JP2013/080268

October 30, 2014

November 08, 2013

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MURATA MANUFACTURING CO (JP)

H05K3/46; H01L21/66

WO1996022008A1

1996-07-18

JPH1154865A	1999-02-26
JP2008288403A	2008-11-27
JP2005259988A	2005-09-22

MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)

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