Title:
MULTI-MODE SENSOR BASED ON WAFER-LEVEL PACKAGE, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/208208
Kind Code:
A1
Abstract:
A multi-mode sensor based on wafer-level package, and a manufacturing method therefor. The multi-mode sensor comprises a base, a multi-mode sensor main body and a cap layer, which are subjected to wafer-level package and are bonded, and a secondary packaged structure and a multi-packaged structure thereof. The base comprises: a first substrate (11), a dielectric layer (12), a first insulating layer (16) and a plurality of silicon through holes (15), wherein the dielectric layer (12) and the first insulating layer (16) respectively cover two faces of the first substrate (11) and are both penetrated by the silicon through hole (15); and electrodes (41) are respectively arranged in through hole regions of the corresponding silicon through holes (15). The multi-mode sensor main body comprises a sensing electrode (20) and a sensing thin-film material layer (21), wherein the sensing electrode (20) is located above the dielectric layer (12), and the sensing thin-film material layer (21) is attached to the sensing electrode (20). The cap layer comprises a second substrate (31) and a bonding ring (32), wherein a first face of the second substrate (31) is provided with an accommodation groove (312), and the bonding ring (32) is arranged on the first face of the second substrate (31). The multi-mode sensor has the advantages of being high in the integration level and performance, being low in costs, being miniaturized, being high in reliability, process feasibility, compatibility and wafer-level uniformity, and having a relatively wide application range.
Inventors:
WANG CHEN (CN)
ZHANG SIMIAN (CN)
DENG XIAONAN (CN)
KE SHENGXIAN (CN)
WU YIFEI (CN)
LI ZHENGCAO (CN)
ZHANG SIMIAN (CN)
DENG XIAONAN (CN)
KE SHENGXIAN (CN)
WU YIFEI (CN)
LI ZHENGCAO (CN)
Application Number:
PCT/CN2023/091674
Publication Date:
November 02, 2023
Filing Date:
April 28, 2023
Export Citation:
Assignee:
UNIV TSINGHUA (CN)
International Classes:
G01N27/12; B81B7/00; B81C1/00; G01D5/14
Foreign References:
| CN114877917A | 2022-08-09 | |||
| CN114894856A | 2022-08-12 | |||
| CN112694062A | 2021-04-23 | |||
| CN104986720A | 2015-10-21 | |||
| CN107265388A | 2017-10-20 | |||
| US20110042819A1 | 2011-02-24 | |||
| CN110579516A | 2019-12-17 | |||
| CN110467148A | 2019-11-19 | |||
| CN111554646A | 2020-08-18 |
Attorney, Agent or Firm:
LINDA LIU & PARTNERS (CN)
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