Title:
MULTI-SURFACE IC PACKAGING STRUCTURES AND METHODS FOR THEIR MANUFACTURE
Document Type and Number:
WIPO Patent Application WO2005031805
Kind Code:
A3
Abstract:
An IC package (400) having multiple surfaces for interconnection with interconnection elements (403) making connections from the IC chip to the I/O terminations (409) of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
Inventors:
FJELSTAD JOSEPH C (US)
SEGARAM PARA K (US)
OBENHUBER THOMAS J (US)
GRUNDY KEVIN P (US)
SEGARAM PARA K (US)
OBENHUBER THOMAS J (US)
GRUNDY KEVIN P (US)
Application Number:
PCT/US2004/031350
Publication Date:
September 29, 2005
Filing Date:
September 24, 2004
Export Citation:
Assignee:
SILICON PIPE INC (US)
FJELSTAD JOSEPH C (US)
SEGARAM PARA K (US)
INESSA OBENHUBER EF (US)
GRUNDY KEVIN P (US)
FJELSTAD JOSEPH C (US)
SEGARAM PARA K (US)
INESSA OBENHUBER EF (US)
GRUNDY KEVIN P (US)
International Classes:
H01L21/56; H01L23/31; H01L23/48; H01L23/495; H01L23/498; H01L; (IPC1-7): H01L23/495; H01L23/48
Foreign References:
| US6441498B1 | 2002-08-27 | |||
| US6369454B1 | 2002-04-09 | |||
| US20020070446A1 | 2002-06-13 |
Other References:
See also references of EP 1671369A4
Download PDF:
Previous Patent: SEMICONDUCTOR DEVICE COMPRISING A PLURALITY OF MEMORY STRUCTURES
Next Patent: DETECTOR WITH TUNABLE SPECTRAL RESPONSE
Next Patent: DETECTOR WITH TUNABLE SPECTRAL RESPONSE