Title:
MULTICOMPONENT TYPE THERMALLY CONDUCTIVE SILICONE GEL COMPOSITION, THERMALLY CONDUCTIVE MEMBER AND HEAT DISSIPATION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/203299
Kind Code:
A1
Abstract:
[Problem] To provide a thermally conductive silicone gel composition which exhibits excellent extrusion properties and mixing stability, while having high thermal conductivity, and which is not susceptible to separation of liquids even if held in two packages or the like, thereby being able to be stably stored, while having excellent gap-filling properties and the like with respect to a heat dissipation component or the like. [Solution] A multicomponent type thermally conductive silicone gel composition which contains (A-1) an alkenyl group-containing organopolysiloxane that has a polymerization degree of 5-100, (A-2) an alkenyl group-containing organopolysiloxane that has a polymerization degree of 400 or more, (B) an organohydrogen polysiloxane, (C) a hydrosilylation catalyst, (D) a thermally conductive filler, (E) a silane coupling agent or the like, and (F) an organopolysiloxane that has a hydrolyzable silyl group at an end of the molecular chain, wherein the mixing viscosity of component (A-1) and component (A-2) is within the range of from 1.15 to 5.50 times the viscosity of component (A-1) at 25°C.
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Inventors:
OTA KENJI (JP)
Application Number:
PCT/JP2020/012000
Publication Date:
October 08, 2020
Filing Date:
March 18, 2020
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
H01L23/36; C08K5/54; C08K5/541; C08L83/06; C08L83/07; H01M10/613
Domestic Patent References:
| WO2019021826A1 | 2019-01-31 | |||
| WO2018016566A1 | 2018-01-25 |
Foreign References:
| JP2011144234A | 2011-07-28 | |||
| JPH11209618A | 1999-08-03 | |||
| JP2000001616A | 2000-01-07 | |||
| JP2005162975A | 2005-06-23 | |||
| JP2014503680W |
Other References:
See also references of EP 3951862A4
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