Title:
MULTIFUNCTION SOLDERING APPARATUS FOR PRINTED BOARD AND SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2006/118138
Kind Code:
A1
Abstract:
In the conventional soldering by a cell method, jet solder baths are required to be replaced and transfer conditions are required to be changed each time when the types of a printed board and an electronic component are changed. It is extremely dangerous when a molten solder spills out at the time of replacing the jet solder baths. In a multifunction soldering apparatus, a jet nozzle suitable for each soldering method is arranged on the jet solder bath which has jet ports at two parts, and the transfer conditions can be changed as needed.
Inventors:
TAKAGUCHI AKIRA (JP)
Application Number:
PCT/JP2006/308715
Publication Date:
November 09, 2006
Filing Date:
April 26, 2006
Export Citation:
Assignee:
SENJU SYSTEM TECHNOLOGY CO LTD (JP)
TAKAGUCHI AKIRA (JP)
TAKAGUCHI AKIRA (JP)
International Classes:
H05K3/34; B23K1/08
Foreign References:
| JP2004358498A | 2004-12-24 | |||
| JPS512652A | 1976-01-10 | |||
| JP2000165028A | 2000-06-16 | |||
| JPH0549167U | 1993-06-29 | |||
| JP2000307229A | 2000-11-02 |
Attorney, Agent or Firm:
Hirose, Shoichi (4-2 Nihonbashi Honcho 4-chom, Chuo-ku Tokyo 23, JP)
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