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Title:
MULTIFUNCTIONAL ELECTRONIC MODULE HOUSING
Document Type and Number:
WIPO Patent Application WO/2013/191364
Kind Code:
A1
Abstract:
The present invention relates to a multifunctional electronic module housing, which includes: an inner cover having an inner fixed frame on which an electronic module is mounted; an outer cover coupled to the inner cover; a gasket coupled to the upper and lower portions of the outer cover; and an upper end cover and a lower end cover coupled to the gasket, wherein the inner cover and the outer cover are coupled to the upper end cover in the upper portion and the lower end cover in the lower portion, respectively.

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Inventors:
HONG JINGWANG (KR)
Application Number:
PCT/KR2013/003404
Publication Date:
December 27, 2013
Filing Date:
April 22, 2013
Export Citation:
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Assignee:
4C CO LTD (KR)
International Classes:
H05K5/02; G01D11/24
Foreign References:
KR200182386Y12000-05-15
JP2565001B21996-12-18
KR20060042538A2006-05-15
KR101117096B12012-06-12
Attorney, Agent or Firm:
LEE, SEUNG-HAN (KR)
이승한 (KR)
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