Title:
MULTILAYER ADHESIVE SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2012/008316
Kind Code:
A1
Abstract:
Provided is a multilayer adhesive sheet which enables easy separation between an adhesive layer and a die attach film during the pick-up even in cases where an acrylate ester copolymer is used in the die attach film, thereby making the pick-up work of semiconductor chips after the dicing easy. The multilayer adhesive sheet comprises a base film, an adhesive layer that is disposed on one surface of the base film, and a die attach film that is disposed on an exposed surface of the adhesive layer. The adhesive that constitutes the adhesive layer contains: (A) a (meth)acrylate ester copolymer; (B) an ultraviolet polymerizable compound; (C) a multifunctional isocyanate curing agent; (D) a photopolymerization initiator; and (E) a silicone polymer.
Inventors:
SAITO TAKESHI (JP)
SHIKANO KAZUNORI (JP)
SHIKANO KAZUNORI (JP)
Application Number:
PCT/JP2011/065149
Publication Date:
January 19, 2012
Filing Date:
July 01, 2011
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
SAITO TAKESHI (JP)
SHIKANO KAZUNORI (JP)
SAITO TAKESHI (JP)
SHIKANO KAZUNORI (JP)
International Classes:
H01L21/52; C09J4/02; C09J7/20; C09J7/22; C09J7/38; C09J133/04; C09J175/14; C09J183/04; H01L21/301
Foreign References:
| JP2006264296A | 2006-10-05 | |||
| JP2008001817A | 2008-01-10 |
Attorney, Agent or Firm:
WATANABE KAORU (JP)
Kaoru Watanabe (JP)
Kaoru Watanabe (JP)
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Claims:
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