Title:
MULTILAYER BODY, BONDING METHOD AND HALF-FINISHED PRODUCT FOR CIRCUIT BOARDS
Document Type and Number:
WIPO Patent Application WO/2021/125258
Kind Code:
A1
Abstract:
A multilayer body according to the present invention comprises: a base material; a circuit board; an insulating layer that is arranged between the base material and the circuit board, while containing a thermally conductive filler; and an adhesive that bonds at least the base material and the insulating layer to each other. With respect to this multilayer body, the base material and the insulating layer are partially bonded to each other by means of the adhesive, while being in contact with each other in other portions; the insulating layer is provided with a plurality of voids; and the voids are at least partially filled with the adhesive.
Inventors:
KAWAKAMI TAKESHI (JP)
Application Number:
PCT/JP2020/047123
Publication Date:
June 24, 2021
Filing Date:
December 17, 2020
Export Citation:
Assignee:
NHK SPRING CO LTD (JP)
International Classes:
H05K1/02; B32B3/30; H05K3/38
Domestic Patent References:
| WO2018043683A1 | 2018-03-08 |
Foreign References:
| JP2010186789A | 2010-08-26 | |||
| JP2009246079A | 2009-10-22 | |||
| JP2013254921A | 2013-12-19 |
Other References:
See also references of EP 4080998A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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