Title:
MULTILAYER BODY, ELECTRONIC COMPONENT AND CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2022/138105
Kind Code:
A1
Abstract:
The present invention provides a multilayer body which has good water vapor barrier properties, while exhibiting excellent adhesion between a base material layer and a clay layer. A multilayer body 30 comprises a base material layer 33, a bonding layer 32 and a clay layer 31. The base material layer 33 contains a crystalline resin. The bonding layer 32 is arranged on one surface of the base material layer 33, while containing a resin that is different from the crystalline resin. The clay layer 31 is arranged on the one surface of the base material layer 33, with the bonding layer 32 being interposed therebetween. The adhesiveness exhibition temperature of the bonding layer 32 is 130°C or less.
Inventors:
HATTORI TAKAYUKI
ONO KOTARO
SHIMASAKI YUKIHIRO
TAKEOKA HIROKI
ONO KOTARO
SHIMASAKI YUKIHIRO
TAKEOKA HIROKI
Application Number:
PCT/JP2021/044688
Publication Date:
June 30, 2022
Filing Date:
December 06, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B32B27/00; B32B15/08; B32B18/00; C01B33/40; H01G2/10; H01G4/224; H01G4/32
Domestic Patent References:
| WO2010024378A1 | 2010-03-04 |
Foreign References:
| JP2019156972A | 2019-09-19 | |||
| JP2005035167A | 2005-02-10 | |||
| JP2019014609A | 2019-01-31 | |||
| JP2013133236A | 2013-07-08 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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