Title:
MULTILAYER BODY, METHOD FOR PRODUCING SAME, AND PACKAGING BAG
Document Type and Number:
WIPO Patent Application WO/2023/243607
Kind Code:
A1
Abstract:
A multilayer body according to one aspect of the present disclosure has a structure wherein a base material layer, a print layer, a first adhesive layer and a sealant layer are stacked in this order; the base material layer is configured from an unstretched polyethylene film; the first adhesive layer is formed using a solvent-free adhesive; and the ratio of polyethylene in the multilayer body is 90% by mass or more.
Inventors:
TANAKA RYOTA (JP)
KITAHARA TSUKASA (JP)
KITAHARA TSUKASA (JP)
Application Number:
PCT/JP2023/021759
Publication Date:
December 21, 2023
Filing Date:
June 12, 2023
Export Citation:
Assignee:
TOPPAN HOLDINGS INC (JP)
International Classes:
B32B9/00; B32B27/32; B65D30/02; B65D65/40
Domestic Patent References:
| WO2019189092A1 | 2019-10-03 | |||
| WO2022131264A1 | 2022-06-23 |
Foreign References:
| JP2021053993A | 2021-04-08 | |||
| JP2021142689A | 2021-09-24 | |||
| JP2022053864A | 2022-04-06 | |||
| JP2022088456A | 2022-06-14 | |||
| JP2022034746A | 2022-03-04 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: