Title:
MULTILAYER BODY FOR MOLDING CONTAINERS, MOLDING CONTAINER AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/270157
Kind Code:
A1
Abstract:
[Problem] To provide a multilayer body for molding containers, the multilayer body enabling the achievement of a molding container that exhibits excellent sealing performance without a fear of damaging openability due to deformation of a flange part at the time when the molding container is opened. [Solution] A multilayer body 1 for molding containers according to the present invention is used as a material for a cup-shaped molding container 2 that has a flange part 23 at the peripheral edge of an opening; and this multilayer body 1 for molding containers sequentially comprises a protective layer 11 that is formed of a synthetic resin, a barrier layer 13 that is formed of an aluminum foil, and a sealing layer 15 that is formed of a thermally fusible resin in this order from the outer side. If σA (N/mm2) is the tensile yield strength of the protective layer 11, tA (mm) is the thickness of the protective layer 11, σB (N/mm2) is the tensile strength of the barrier layer 13, tB is the thickness of the barrier layer 13, σC (N/mm2) is the tensile yield strength of the sealing layer 15, and tC (mm) is the thickness of the sealing layer 15, 16 ≤ σA × tA + σB × tB + σC × tC ≤ 25 is satisfied.
Inventors:
TANAKA YUKI (JP)
Application Number:
PCT/JP2022/019499
Publication Date:
December 29, 2022
Filing Date:
May 02, 2022
Export Citation:
Assignee:
SHOWA DENKO PACKAGING CO LTD (JP)
International Classes:
B32B15/08; B32B15/20; B65D65/40; B65D77/20
Domestic Patent References:
| WO2015087901A1 | 2015-06-18 | |||
| WO2009050899A1 | 2009-04-23 |
Foreign References:
| JP2021059387A | 2021-04-15 | |||
| CN101086316A | 2007-12-12 | |||
| JP2006298381A | 2006-11-02 | |||
| JP2005119692A | 2005-05-12 | |||
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| JP2012214248A | 2012-11-08 | |||
| JP2017094746A | 2017-06-01 | |||
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| US20160159541A1 | 2016-06-09 |
Attorney, Agent or Firm:
MATSUMURA Naoto et al. (JP)
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