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Patent Searching and Data


Title:
MULTILAYER BODY, PACKAGING BAG AND METHOD FOR PRODUCING PACKAGING BAG
Document Type and Number:
WIPO Patent Application WO/2024/048457
Kind Code:
A1
Abstract:
This multilayer body comprises at least a first resin layer and a second resin layer; the first resin layer is provided on the second resin layer in a removable manner; the peel strength between the first resin layer and the second resin layer is 1.0 N/15 mm width or less; and the requirement (1) described below and/or the requirement (2) described below is satisfied. (1) The second resin layer is a sealant layer which comprises at least a polyethylene layer that has a density of 0.909 g/cm3 or less, and the polyethylene layer in the second resin layer is in contact with the first resin layer. (2) The second resin layer is a sealant layer which contains a polyolefin as a main component, and the content ratio of the polyolefin in the second resin layer is 82% by mass or more based on the mass of the second resin layer.

Inventors:
TAKASUGI YUYA (JP)
KASHIHARA TOMOMI (JP)
TANAKA YUYA (JP)
OTSUKA KOJI (JP)
MURAYAMA TATSUHIKO (JP)
HIGASHINO MISATO (JP)
Application Number:
PCT/JP2023/030748
Publication Date:
March 07, 2024
Filing Date:
August 25, 2023
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B32B27/32; B32B7/022; B32B7/06; B65D33/00; B65D65/40
Foreign References:
JP2021066185A2021-04-30
JP2003246901A2003-09-05
JPS5578432U1980-05-30
JP2004244048A2004-09-02
JP2009132417A2009-06-18
JP2001162727A2001-06-19
JP2000079949A2000-03-21
JPH10235773A1998-09-08
JP2002211580A2002-07-31
JP2002211579A2002-07-31
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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