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Patent Searching and Data


Title:
MULTILAYER BODY AND PACKAGING BAG
Document Type and Number:
WIPO Patent Application WO/2023/243390
Kind Code:
A1
Abstract:
A multilayer body according to the present invention comprises base materials and sealant layers, which are alternately stacked upon each other. The base materials and the sealant layers are resin layers that are mainly composed of a polypropylene; the ratio of the total mass of the polypropylene in the multilayer body is 90% by mass or more; the sealant layers contain a nucleator; and the thickness of the sealant layers is 30% to 95% of the thickness of the multilayer body, while being 20 µm to 200 µm.

Inventors:
FUKUDA YUKA (JP)
RO KAZUYOSHI (JP)
NAKAZAWA NAOKI (JP)
Application Number:
PCT/JP2023/020034
Publication Date:
December 21, 2023
Filing Date:
May 30, 2023
Export Citation:
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Assignee:
TOPPAN HOLDINGS INC (JP)
International Classes:
B32B27/32; B65D65/40
Domestic Patent References:
WO2006118030A12006-11-09
Foreign References:
JP2022042574A2022-03-15
JPS62233248A1987-10-13
JPH10138419A1998-05-26
JP2017193063A2017-10-26
JP2019172780A2019-10-10
JP2022054775A2022-04-07
JP2017121707A2017-07-13
JP2020175652A2020-10-29
JPH0269237A1990-03-08
JPH11138716A1999-05-25
JP2012045884A2012-03-08
US20170342247A12017-11-30
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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