Title:
MULTILAYER CERAMIC CAPACITOR, PACKAGING, AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2024/009791
Kind Code:
A1
Abstract:
According to the present invention, a multilayer ceramic capacitor has a dimension in a first-axis direction that is at least 1.5 times the dimension thereof in a second axis direction perpendicular to the first axis, and is mounted on a mounting surface perpendicular to the first axis. The multilayer ceramic capacitor comprises a ceramic element body and an external electrode. The ceramic element body has: a pair of main surfaces perpendicular to the first axis; end surfaces perpendicular to a third axis perpendicular to the first and second axes; and a plurality of internal electrodes that contain Ni as a main component, are stacked in the second axis direction, and extend to connection terminals on the end surfaces. The external electrode contains Cu as a main component and covers the end surfaces. The plurality of internal electrodes are composed of: outer layer internal electrodes located on both outer sides in the second axis direction; and inner layer internal electrodes located on the inner side in the second axis direction. The distance between the pair of main surfaces is greater at the connection terminals of outer layer internal electrodes than at the third-axis directional center of inner layer internal electrodes.
Inventors:
SHIROTA AYUMI (JP)
Application Number:
PCT/JP2023/023184
Publication Date:
January 11, 2024
Filing Date:
June 22, 2023
Export Citation:
Assignee:
TAIYO YUDEN KK (JP)
International Classes:
H01G4/30
Foreign References:
| JP2022008697A | 2022-01-14 | |||
| JP2007134375A | 2007-05-31 | |||
| JP2013120927A | 2013-06-17 |
Attorney, Agent or Firm:
KATAYAMA, Shuhei (JP)
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