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Patent Searching and Data


Title:
MULTILAYER CERAMIC CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2023/238512
Kind Code:
A1
Abstract:
The present invention provides a multilayer ceramic capacitor which can be soldered reliably, while improving the bending resistance of a mounting substrate on which the multilayer ceramic capacitor is mounted. A multilayer ceramic capacitor according to the present invention is provided with: a multilayer body that comprises a plurality of stacked dielectric layers and stacked internal electrode layers, while having a first main surface and a second main surface, which are opposite to each other in the stacking direction, a first lateral surface and a second lateral surface, which are opposite to each other in the width direction that is perpendicular to the stacking direction, and a first end surface and a second end surface, which are opposite to each other in the length direction that is perpendicular to the stacking direction and the width direction; a first external electrode that is arranged on the first end surface; and a second external electrode that is arranged on the second end surface. The first external electrode and the second external electrode each have a base electrode layer, a lower plating layer that is arranged on the surface of the base electrode layer, and an upper plating layer that is arranged on the surface of the lower plating layer; the lower plating layer has an average thickness of 2.0 µm to 5.0 µm; and the lower plating layer is dotted with thin regions which have a thickness that is thinner than the average thickness of the lower plating layer.

Inventors:
SUGATA TAKESHI (JP)
KANETA SHOUGO (JP)
Application Number:
PCT/JP2023/015321
Publication Date:
December 14, 2023
Filing Date:
April 17, 2023
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01G4/30
Foreign References:
JP2022077225A2022-05-23
JP2019062100A2019-04-18
JP2021174970A2021-11-01
Attorney, Agent or Firm:
OKADA, Masahiro (JP)
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