Title:
MULTILAYER FILM, PACKAGING MATERIAL, AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/255041
Kind Code:
A1
Abstract:
The present disclosure relates to a multilayer film. This multilayer film is provided with the following in the indicated sequence: a first outer layer, which is a heat-seal layer and comprises a propylene homopolymer (A) and a propylene·ethylene random copolymer (B); an inner layer comprising a propylene·ethylene block copolymer (C) and an ethylene·propylene copolymer elastomer (D); and a second outer layer comprising the propylene homopolymer (A) and the propylene·ethylene random copolymer (B). At least any of the first outer layer, the inner layer, and the second outer layer additionally contains a polyphenol compound.
Inventors:
HAMADA DAISUKE (JP)
Application Number:
PCT/JP2022/019845
Publication Date:
December 08, 2022
Filing Date:
May 10, 2022
Export Citation:
Assignee:
TOPPAN INC (JP)
International Classes:
B32B27/32; B32B27/18; B65D65/40
Domestic Patent References:
| WO2019225282A1 | 2019-11-28 |
Foreign References:
| JP2017132187A | 2017-08-03 | |||
| JP2019018435A | 2019-02-07 | |||
| JPH0623925A | 1994-02-01 | |||
| JP2008062497A | 2008-03-21 | |||
| CN107163349A | 2017-09-15 | |||
| JP2013018551A | 2013-01-31 | |||
| JP2019177521A | 2019-10-17 |
Other References:
"Polymer Analysis Handbook", 10 May 2013, JAPAN SOCIETY OF ANALYTICAL CHEMISTRY, pages: 412 - 413
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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