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Patent Searching and Data


Title:
MULTILAYER FILM AND PACKAGING MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/075233
Kind Code:
A1
Abstract:
This multilayer film includes a first resin layer and a second resin layer, wherein: the first resin layer and the second resin layer each contain a poly(3-hydroxyalkanoate)-based resin; the ratio of the thickness of the first resin layer:the thickness of the second resin layer is 1.0:0.015 to 1.0:5.0; the heat quantity ∆H of the first resin layer is at least 30 J/g; and the heat quantity ∆H of the second resin layer is at most 25 J/g, provided that the heat quantity ∆H is a fusion heat quantity in the range of 130-190ºC.

Inventors:
MIAO WEI
SUGIYAMA TAKESHI
SAITO ARIHIRO
MURASAWA SHUN
OKURA TETSUO
Application Number:
PCT/JP2021/036494
Publication Date:
April 14, 2022
Filing Date:
October 01, 2021
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
B32B27/36; B65D65/02; B65D65/40; C08K13/02; C08L67/04; C08L101/16
Domestic Patent References:
WO2016190301A12016-12-01
WO2020195550A12020-10-01
WO2013147139A12013-10-03
WO2010013483A12010-02-04
Foreign References:
JP2014144553A2014-08-14
JP2018504292A2018-02-15
US20160271909A12016-09-22
JP2005144726A2005-06-09
JP2015024123A2015-02-05
JP2019166703A2019-10-03
US20200376822A12020-12-03
JP2014144553A2014-08-14
JP2005507018W
Other References:
T. FUKUIY. DOI, J. BACTERIOL., vol. 179, 1997, pages 4821 - 4830
Attorney, Agent or Firm:
ARCO PATENT & TRADEMARK ATTORNEYS (JP)
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