Title:
MULTILAYER FILM, MULTILAYER STRUCTURE, PACKAGING MATERIAL, RECOVERY COMPOSITION, AND METHOD FOR RECOVERING MULTILAYER FILM OR MULTILAYER STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/112929
Kind Code:
A1
Abstract:
This multilayer film has: a barrier layer (A) containing as the main component thereof an ethylene-vinyl alcohol copolymer (a) having an ethylene unit content of 20-50 mol% and a degree of saponification of at least 90 mol%; an adhesive layer (B) containing as the main component thereof an adhesive resin (b); and a hot melt bonding layer (C) containing as the main component thereof an ethylene-α-olefin copolymer resin (c) that has a density of 0.880-0.920 g/cm3. The multilayer film does not have: a layer containing as the main component thereof a resin having a melting point of 200°C or more; or a metal layer having a thickness of 1 µm or more. The hot melt bonding layer (C) contains 100-7,000 ppm of a higher fatty acid amide compound (d) that has a melting point of 60-120°C.
More Like This:
| WO/2022/175555 | FILMS FOR MULTIPLE LAYERS ASSEMBLIES |
| JP5629310 | Multi-layer structure and its manufacturing method |
Inventors:
YOSHIDA KENTARO (JP)
Application Number:
PCT/JP2022/045916
Publication Date:
June 22, 2023
Filing Date:
December 13, 2022
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
B32B27/28; B65D65/40
Domestic Patent References:
| WO2011068105A1 | 2011-06-09 | |||
| WO2020071513A1 | 2020-04-09 |
Foreign References:
| JP2005220307A | 2005-08-18 | |||
| JP2012245767A | 2012-12-13 | |||
| JP2002173561A | 2002-06-21 |
Attorney, Agent or Firm:
IKEDA Yoshinori (JP)
Download PDF: