Title:
MULTILAYER FILM FOR SUPPORTING TRANSPARENT CONDUCTIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2020/136965
Kind Code:
A1
Abstract:
A multilayer film (20) according to the present invention comprises: a base material film (16) for supporting a transparent conductive layer (17); and a protective film (14) which supports the base material film (16), with an adhesive layer (15) being interposed therebetween. The base material film (16) and the protective film (14) contain a cycloolefin resin. The film thickness of the base material film (16) is from 5 μm to 40 μm (inclusive). When the base material film (16) is heated at 140°C for 90 minutes, the thermal shrinkage A (%) of the base material film (16) in the width direction is from 0.01% to 0.20% (inclusive). If B (%) is the thermal shrinkage of the protective film (14) in the width direction as measured when the protective film (14) is heated at 140°C for 90 minutes, A and B satisfy 0.02 ≤ A/B ≤ 0.50.
Inventors:
INAGAKI AYAKO (JP)
Application Number:
PCT/JP2019/029286
Publication Date:
July 02, 2020
Filing Date:
July 25, 2019
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
B32B27/00; B32B7/028; B32B7/035; G06F3/041; H01B5/14; H01B13/00
Domestic Patent References:
| WO2018109867A1 | 2018-06-21 |
Foreign References:
| JP2018151760A | 2018-09-27 | |||
| JP2016107503A | 2016-06-20 | |||
| JP2018152187A | 2018-09-27 | |||
| JP2001332132A | 2001-11-30 | |||
| JP2017177445A | 2017-10-05 |
Attorney, Agent or Firm:
SANO PATENT OFFICE (JP)
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