Title:
MULTILAYER HEAT RECOVERY ARTICLE, WIRE SPLICE AND WIRE HARNESS
Document Type and Number:
WIPO Patent Application WO/2015/045644
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide an easily-manufactured multilayer heat recovery article which generates little bloom and bleed and has excellent copper corrosion resistance, and to provide a wire splice and wire harness using said multilayer heat recovery article. This multilayer heat recovery article is provided with a cylindrical base layer and an adhesive layer laminated on the inner peripheral surface of the base layer. The base layer contains polyethylene and an antioxidant, the adhesive layer contains an ethylene-vinyl acetate copolymer and an antioxidant; the oxidation induction temperature of the base layer is 255-270°C and the oxidation induction temperature of the adhesive layer is greater than or equal to 255°C.
More Like This:
Inventors:
YAMASAKI SATOSHI (JP)
EMOTO YASUTAKA (JP)
OKABE SHOUHEI (JP)
EMOTO YASUTAKA (JP)
OKABE SHOUHEI (JP)
Application Number:
PCT/JP2014/071016
Publication Date:
April 02, 2015
Filing Date:
August 08, 2014
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELEC FINE POLYMER INC (JP)
SUMITOMO ELEC FINE POLYMER INC (JP)
International Classes:
B32B1/08; B32B7/027; H01B7/00; H01B17/58; H02G1/14; H02G15/18
Domestic Patent References:
| WO2014097694A1 | 2014-06-26 |
Foreign References:
| JP2000119403A | 2000-04-25 | |||
| JP2010185056A | 2010-08-26 | |||
| JP2000129042A | 2000-05-09 | |||
| JPH0732529A | 1995-02-03 | |||
| JP2014069522A | 2014-04-21 | |||
| JPH06176649A | 1994-06-24 |
Other References:
See also references of EP 3050699A4
Attorney, Agent or Firm:
NAKATA, Motomi et al. (JP)
Nakada Motoki (JP)
Nakada Motoki (JP)
Download PDF:
Previous Patent: DEVICE FOR CONTROLLING HYBRID VEHICLE
Next Patent: IMAGE CAPTURING DEVICE, IMAGE CAPTURING METHOD, AND PROGRAM
Next Patent: IMAGE CAPTURING DEVICE, IMAGE CAPTURING METHOD, AND PROGRAM