Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
MULTILAYER LABEL
Document Type and Number:
WIPO Patent Application WO/2022/202856
Kind Code:
A1
Abstract:
The present invention relates to a multilayer label having a substrate, one or more resin layers and an adhesive layer in the order stated. Any interlayer in a laminate structure composed of the substrate and the one or more resin layers is peelably bonded and at least one resin layer out of the one or more resin layers is a resin layer (X) including a biodegradable resin (A) and a filler (B), of which the average particle diameter (D50) is 1-20 μｍ.

Inventors:
TAYA NAOKI (JP)
SATO KEIICHI (JP)
MIYATA SOU (JP)
Application Number:
PCT/JP2022/013336
Publication Date:
September 29, 2022
Filing Date:
March 23, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
LINTEC CORP (JP)
International Classes:
G09F3/10; B32B7/06; B32B27/00; B32B27/20; B42D11/00; C09J11/04; C09J167/00
Foreign References:
JP2009208392A2009-09-17
JP2005140939A2005-06-02
JPH079642A1995-01-13
JP2016061929A2016-04-25
US20090117377A12009-05-07
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: CONSTRUCTION MACHINE AND CONSTRUCTION MACHINE ASSISTING METHOD

Next Patent: MULTILAYER LABEL