Title:
MULTILAYER LCP CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/041320
Kind Code:
A1
Abstract:
The present application provides a multilayer LCP circuit board, comprising: a first LCP copper clad laminate, at least one second LCP copper clad laminate, and a third LCP copper clad laminate that are sequentially stacked and laminated without glue. The second LCP copper clad laminate comprises a second LCP layer and a second copper foil layer laminated with the second LCP layer; the second copper foil layer comprises product molding areas and a waste area surrounding the product molding areas; a plurality of honeycomb structures are etched in the waste area; and the etching edges of the honeycomb structures are communicated with each other. According to the multilayer LCP circuit board of the present application, the honeycomb structures are etched in the waste area of the LCP copper clad laminate at the inner layer, and the etching edges of the honeycomb structures are communicated with each other, such that bubbles generated when a product is laminated can be effectively discharged, and meanwhile, the honeycomb structures are beneficial for releasing pressing stress and preventing expansion and contraction deformations of the product, thereby improving the yield of the product.
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Inventors:
JI MEIYANG (CN)
CHEN YONGLI (CN)
HAN JIAMING (CN)
CHEN YONGLI (CN)
HAN JIAMING (CN)
Application Number:
PCT/CN2020/114191
Publication Date:
March 03, 2022
Filing Date:
September 09, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC MODULE TECH CHANGZHOU CO LTD (CN)
AAC MODULE TECH CHANGZHOU CO LTD (CN)
International Classes:
H05K3/46; H05K1/03
Foreign References:
| CN110881241A | 2020-03-13 | |||
| CN101090604A | 2007-12-19 | |||
| TW200803635A | 2008-01-01 | |||
| GB2324200A | 1998-10-14 |
Attorney, Agent or Firm:
SHENZHEN CHINA INNOVATION SOUTH INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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