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Title:
MULTILAYER MATERIAL, METHOD OF FORMING RESIN PATTERN, SUBSTRATE, DISPLAY APPARATUS AND LIQUID CRYSTAL DISPLAY APPARATUS
Document Type and Number:
WIPO Patent Application WO/2007/097112
Kind Code:
A1
Abstract:
A multilayer material comprising a thermoplastic resin layer containing a compound capable of expanding the thermoplastic resin layer per se upon energization, wherein when (X) refers to a peeling force between a temporary support and the thermoplastic resin layer and (Y) to a peeling force between an interlayer and the thermoplastic resin layer, the relationship (X)>(Y) is satisfied at the time of peeling. Further, there is provided a method of forming a resin pattern, comprising employing the multilayer material, expanding the thermoplastic resin layer by energization and peeling the temporary support together with the thermoplastic resin layer. Still further, there are provided a substrate furnished with a resin pattern by the above forming method; and a display apparatus, and liquid crystal display apparatus, including the substrate.

Inventors:
GOTOH HIDENORI (JP)
Application Number:
PCT/JP2006/326271
Publication Date:
August 30, 2007
Filing Date:
December 28, 2006
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
GOTOH HIDENORI (JP)
International Classes:
G03F7/004; G02F1/13; G03F7/09; G03F7/38
Foreign References:
JPH09281701A1997-10-31
JP2003076001A2003-03-14
JP2006023405A2006-01-26
JP2003307845A2003-10-31
JP2003005364A2003-01-08
JP2005064143A2005-03-10
JP2003346648A2003-12-05
JPS61156251A1986-07-15
JPS5511281A1980-01-26
Attorney, Agent or Firm:
NAKAJIMA, Jun et al. (NAKAJIMA & KATO Seventh Floor HK-Shinjuku Bldg., 3-1, Shinjuku 4-chome Shinjuku-ku Tokyo 22, JP)
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