Title:
MULTILAYER STRUCTURE INCLUDING INSULATING ADHESIVE LAYER, AND CURED ARTICLE OF SAME
Document Type and Number:
WIPO Patent Application WO/2024/106433
Kind Code:
A1
Abstract:
The present disclosure provides, inter alia: a multilayer structure including an insulating adhesive layer that exhibits a low dielectric constant, a low dielectric tangent, and a low water absorption rate, the insulating adhesive layer also exhibiting high adhesiveness to a metal foil, to an insulating resin layer, or to both the metal foil and the insulating resin layer due to curing; and a cured article of the multilayer structure. A multilayer structure according to the present disclosure is characterized by including a metal foil that has an open surface on at least a portion thereof, an insulating resin layer, and an insulating adhesive layer that is composed of a composition containing an olefin-aromatic vinyl compound-aromatic polyene copolymer and a carboxylic-acid-group-including or acid-anhydride-group-including monomer or polymer, the insulating adhesive layer being joined to the insulating resin layer, and the insulating adhesive layer being joined to the surface of the metal foil that is on the opposite side from the open surface.
Inventors:
ARAI TORU (JP)
Application Number:
PCT/JP2023/040938
Publication Date:
May 23, 2024
Filing Date:
November 14, 2023
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B32B15/08; B32B27/00; C08F210/00; C08K5/09; C08L23/02; C08L23/26; H05K1/03
Domestic Patent References:
| WO2022014599A1 | 2022-01-20 | |||
| WO2021112087A1 | 2021-06-10 | |||
| WO2021112088A1 | 2021-06-10 |
Foreign References:
| JP2022085610A | 2022-06-08 | |||
| JP2010280771A | 2010-12-16 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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