MULTILAYER STRUCTURE, AND PACKAGING MATERIAL USING SAME

WIPO Patent Application WO/2022/080458

A1

Provided is a multilayer film having a layered structure in which a PO layer (A), an adhesive resin layer (B), and an EVOH layer (C) are stacked in this order. The EVOH layer (C) contains: EVOH (c1) having an ethylene unit content of 20-60 mol% and a saponification degree of at least 90 mol%; and a hydrophobic plasticizer (c2). The content of the EVOH (c1) in the EVOH layer (C) is 60-99.9 mass%. An average value of an ethylene unit content of the EVOH (c1) constituting the EVOH layer (C) is 30-60 mol%. The content of the hydrophobic plasticizer (c2) in the EVOH layer (C) is 0.1-3 mass%. The EVOH layer (C) may further contain a phosphate compound (c3) in an amount no greater than 500 ppm in terms of a phosphate radical conversion amount. The EVOH resin composition layer (C) does not contain nylon 6. A thickness ratio of the EVOH resin composition layer (C) to a total thickness of the multilayer film is no greater than 7.5%. The multilayer film has superior appearance, recyclability, bending resistance, and quality stability, and can thus be suitably used as, for example, a packaging material such as a food packaging material, a beverage packaging material, a pharmaceutical packaging material, and a cosmetic packaging material, and an agricultural material.

SHIMO HIROYUKI (JP)
KITAMURA MASAHIRO (BE)
DIDIER HOUSSIER (BE)

PCT/JP2021/038090

April 21, 2022

October 14, 2021

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KURARAY CO (JP)

B32B27/22; B32B27/28; B32B27/32; B65D65/40

WO2020071513A1

2020-04-09

JPH06270346A	1994-09-27
JPH06270345A	1994-09-27
JP2002052660A	2002-02-19
JP2001079996A	2001-03-27
JP2000264328A	2000-09-26

SETOUCHI INTERNATIONAL PATENT FIRM (JP)

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