Title:
MULTILAYER STRUCTURE AND USES THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/123739
Kind Code:
A1
Abstract:
[Problem] To provide a member for electronic devices which, even when being a dielectric sheet comprising a cured dielectric polymer that is physically fragile, has excellent handleability while retaining the intact flatness and performances (flexibility and dielectric properties).
[Solution] A multilayer structure which comprises (L1) one or more high-dielectric sheets comprising a cured polymer having a dielectric functional group and (L2) at least one pressure-sensitive adhesive layer and which may further include one or more layers selected from among (L3) electrode layers and (L4) non-silicone type thermoplastic resin layers; and uses of the multilayer structure.
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Inventors:
FUKUI HIROSHI (JP)
TSUDA TAKEAKI (JP)
TSUDA TAKEAKI (JP)
Application Number:
PCT/JP2018/033959
Publication Date:
June 27, 2019
Filing Date:
September 13, 2018
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C09J7/25; B32B7/02; B32B27/00; B32B27/26; C09J7/38; C09J183/04
Domestic Patent References:
| WO2016140131A1 | 2016-09-09 | |||
| WO2016163069A1 | 2016-10-13 | |||
| WO2017183541A1 | 2017-10-26 | |||
| WO2017104710A1 | 2017-06-22 | |||
| WO2014105959A1 | 2014-07-03 | |||
| WO2016098334A1 | 2016-06-23 | |||
| WO2016163069A1 | 2016-10-13 | |||
| WO2017183541A1 | 2017-10-26 |
Foreign References:
| JP2010228295A | 2010-10-14 | |||
| JP2013003952A | 2013-01-07 | |||
| JP2014522436A | 2014-09-04 | |||
| JP2006349736A | 2006-12-28 | |||
| JP2013139515A | 2013-07-18 | |||
| JP2014522436W | ||||
| JP2013512326W | ||||
| JP2014522436A | 2014-09-04 | |||
| JP2013512326A | 2013-04-11 |
Other References:
See also references of EP 3730565A4
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