Title:
MULTILAYER SUBSTRATE, MULTILAYER SUBSTRATE ARRAY, AND TRANSMISSION/RECEPTION MODULE
Document Type and Number:
WIPO Patent Application WO/2018/193844
Kind Code:
A1
Abstract:
The present invention realizes a multilayer substrate and a multilayer substrate array that allow a high degree of freedom in manufacturing thereof. In a multilayer substrate (100) that has wiring provided in an inner layer, at least a part of the perimeter (51) thereof is formed to have a wave shape.
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Inventors:
WADA HIDEYUKI (JP)
Application Number:
PCT/JP2018/014416
Publication Date:
October 25, 2018
Filing Date:
April 04, 2018
Export Citation:
Assignee:
FUJIKURA LTD (JP)
International Classes:
H05K1/02; H01Q1/38; H01Q21/08; H01Q23/00; H05K3/46; H05K9/00
Domestic Patent References:
| WO2008010445A1 | 2008-01-24 |
Foreign References:
| JP2003508945A | 2003-03-04 | |||
| JPS5678300U | 1981-06-25 | |||
| JP2001007628A | 2001-01-12 | |||
| JP2008263360A | 2008-10-30 |
Other References:
See also references of EP 3614814A4
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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