Title:
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/117341
Kind Code:
A1
Abstract:
This multilayer substrate has: a first substrate having a through-hole; a second substrate that is formed of a material different from that of the first substrate and that is bonded to the first substrate; a first bonding layer that is formed, before bonding, at the surface of the first substrate facing the second substrate; and a second bonding layer that is formed, before bonding, at the surface of the second substrate facing the first substrate. The first bonding layer and the second bonding layer are formed of a conductor or a semiconductor and are bonded together so as to face one other.
Inventors:
YAMASHITA TARO (JP)
Application Number:
PCT/JP2020/039185
Publication Date:
June 17, 2021
Filing Date:
October 16, 2020
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
H01L21/02; H01L21/3065
Foreign References:
| JP2010199374A | 2010-09-09 | |||
| JP2001007346A | 2001-01-12 | |||
| JP2003203886A | 2003-07-18 | |||
| JPH06120180A | 1994-04-28 | |||
| JPH06349792A | 1994-12-22 | |||
| JP2014135385A | 2014-07-24 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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