Title:
MULTILAYER SUBSTRATE, MOUNTING STRUCTURE FOR MULTILAYER SUBSTRATE, METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/107131
Kind Code:
A1
Abstract:
This multilayer substrate (101) is provided with: a laminate (10) that has a first main surface (VS1); and a conductor pattern (including mounting electrodes P1, P2 formed on the first main surface VS1, and first auxiliary patterns 41A, 41B formed on the first main surface VS1). The laminate (10) is obtained by laminating a plurality of insulation substrate layers (11, 12, 13, 14) which have a resin as a main material. The first auxiliary patterns (41A, 41B) are disposed adjacent to the mounting electrodes (P1, P2). The mounting electrodes (P1, P2) are interposed between another conductor pattern (mounting electrode) and a first auxiliary pattern in a plan view (seen from the Z-axis direction) of the first main surface (VS1).
Inventors:
ITO SHINGO (JP)
GOUCHI NAOKI (JP)
GOUCHI NAOKI (JP)
Application Number:
PCT/JP2018/041806
Publication Date:
June 06, 2019
Filing Date:
November 12, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F17/00; H01F27/29; H01G4/228; H05K1/02; H05K3/46
Domestic Patent References:
| WO2017082017A1 | 2017-05-18 | |||
| WO2016199516A1 | 2016-12-15 | |||
| WO2017110460A1 | 2017-06-29 | |||
| WO2016163212A1 | 2016-10-13 |
Foreign References:
| JP2007259410A | 2007-10-04 | |||
| JP2014207432A | 2014-10-30 | |||
| JP2013084871A | 2013-05-09 | |||
| JP2014103371A | 2014-06-05 | |||
| JP2017103354A | 2017-06-08 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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