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Patent Searching and Data


Title:
NAIL TIP, SYSTEM FOR PRODUCING SAME, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/156995
Kind Code:
A1
Abstract:
[Problem] Provided is a nail tip with the entire bonding surface thereof demonstrating high bonding strength and high fitness to a finger of a user. [Solution] A nail tip 10 capable of being attached to and detached from a nail of a user is formed along the surface of a nail 32 of a user and comprises: a first portion 19 that is capable of being attached to and detached from the nail 32; an engaging portion 20 in which an engaging piece 24 for holding, between the surface side and the engaging piece 24, the leading edge of the nail is formed on the back surface side so as to protrude therefrom; and a second portion 21 formed in the direction to which the nail grows, with the surface of the second portion 21 being continuous with the surface of the first portion 19 and the surface of the engaging portion 20. The first portion 19 is taken by measuring the shape of the nail of a user through 3D measurement. Thus, the engaging portion 20 catches on the leading edge 34 of the nail 32, improving the bonding strength and fitness between the first portion 19 of the nail tip 10 and the nail 32. The nail tip may be firmly bonded or may be bonded so that the nail tip is easily removed depending on the type of the bonding member 40.

Inventors:
IDE AKINORI (JP)
Application Number:
PCT/JP2020/004496
Publication Date:
August 12, 2021
Filing Date:
February 06, 2020
Export Citation:
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Assignee:
P SHINE CO LTD (JP)
International Classes:
A45D31/00
Foreign References:
US5413123A1995-05-09
JPS4837794U1973-05-09
JP3096851U2004-01-08
JP2010012071A2010-01-21
US20160249724A12016-09-01
JP2013220146A2013-10-28
JP2006519030A2006-08-24
JP2019130386A2019-08-08
JP2007055255A2007-03-08
JP2000194838A2000-07-14
Attorney, Agent or Firm:
TAKAKU, Yukiko (JP)
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