Title:
NANO-SILVER PASTE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/227736
Kind Code:
A1
Abstract:
Disclosed in the present invention are a nano-silver paste and a preparation method therefor. The nano-silver paste in the present invention comprises nano-silver powder, micro-tin-based solder powder particles, a reducing agent, a dispersing agent and a diluent. The nano-silver paste in the present invention is obtained by uniformly mixing the nano-silver powder and the micron tin-based solder powder particles with the reducing agent, the dispersing agent and the diluent. By means of the nano-silver paste in the present invention, the problem in the prior art of a nano-silver paste having a low stacking density, having a high porosity, being severe in terms of volume shrinkage, being prone to cracks and having a low interfacial bonding rate when same is sealed without pressure is solved, such that the mechanical properties and reliability of a sealing position are improved.
Inventors:
CAI HANGWEI (CN)
DU KUN (CN)
XU SIMEI (CN)
DU KUN (CN)
XU SIMEI (CN)
Application Number:
PCT/CN2022/073665
Publication Date:
November 03, 2022
Filing Date:
January 25, 2022
Export Citation:
Assignee:
SOLDERWELL MICROELECTRONIC PACKAGING MAT CO LTD (CN)
International Classes:
H01B1/02; H01B1/22; H01B13/00
Domestic Patent References:
| WO2019100445A1 | 2019-05-31 |
Foreign References:
| CN113284645A | 2021-08-20 | |||
| CN107175433A | 2017-09-19 | |||
| JP2020097774A | 2020-06-25 | |||
| CN110238562A | 2019-09-17 | |||
| CN109215828A | 2019-01-15 |
Attorney, Agent or Firm:
GUANGZHOU RONDA INTELLECTUAL PROPERTY AGENCY (CN)
Download PDF: