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Title:
NBTI SUPERCONDUCTING MULTI-CORE WIRE
Document Type and Number:
WIPO Patent Application WO/2022/075127
Kind Code:
A1
Abstract:
This NbTi superconducting multi-core wire comprises: a core section; a first barrier layer, disposed on the outer periphery of the core section and formed from a first copper alloy that includes at least one element between nickel and manganese; a filament aggregate, disposed on the outer periphery of the first barrier layer and comprising a plurality of NbTi filament aggregates formed by embedding a plurality of NbTi filaments, of which there are at least seven, in a matrix formed from a second copper alloy that includes at least one element between nickel and manganese; a second barrier layer, disposed on the outer periphery of the filament aggregate and formed from the first copper alloy; and a stabilizing layer, disposed on the outer periphery of the second barrier layer and formed from a metal. In a horizontal cross-section perpendicular to the longitudinal direction, the plurality of NbTi filaments in each of the NbTi filament aggregates are disposed in one or more circular shapes of different diameters, centered on one NbTi filament, and the plurality of NbTi filaments disposed in the circular shape at the outermost periphery are arranged at roughly equal intervals in the circumferential direction.

Inventors:
SUGIMOTO MASAHIRO (JP)
KATAYAMA KOTA (JP)
II HIDEKI (JP)
KATO TOMOYA (JP)
Application Number:
PCT/JP2021/035746
Publication Date:
April 14, 2022
Filing Date:
September 29, 2021
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C22C27/02; C22C9/06; H01B12/10; H01F6/06
Domestic Patent References:
WO2008044500A12008-04-17
Foreign References:
JPH0992051A1997-04-04
JP3445307B22003-09-08
Other References:
IEEJ TRANSACTIONS ON POWER AND ENERGY, vol. 111, no. 4, 1991, pages 366 - 373
MAGNET TECHNOLOGY (MT-11), PROCEEDINGS, 1989, pages 1027 - 1032
IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, vol. 25, no. 3, 2015, pages 6001405
Attorney, Agent or Firm:
SAITO Takuya et al. (JP)
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