Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM AND PREPARATION METHOD THEREFOR, EL ELEMENT, AND DISPLAY APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/246811
Kind Code:
A1
Abstract:
The present application provides a negative photosensitive resin composition, a cured film and a preparation method therefor, an EL element, and a display apparatus. The negative photosensitive resin composition comprises (A) an alkali-soluble resin containing a polyimide structure; (B) a radical polymerizable compound; (C) at least one photopolymerization initiator having the structure as shown in the following formula (I); and optionally (D) a black dye and/or pigment. By applying the technical solution of the present application, a negative photosensitive composition provided by the present application has excellent heat resistance and light shielding performance; when the negative photosensitive composition is applied to a light-emitting device, no gas leakage can be detected in a high-temperature environment, no device pollution is caused, and the negative photosensitive composition has a wide application prospect.
Inventors:
QIAN BIN (CN)
Application Number:
PCT/CN2023/101514
Publication Date:
December 28, 2023
Filing Date:
June 20, 2023
Export Citation:
Assignee:
CHANGZHOU TRONLY ADVANCED ELECTRONIC MAT CO LTD (CN)
CHANGZHOU TRONLY NEW ELECTRONIC MAT CO LTD (CN)
CHANGZHOU LEADER NEW ELECTRONIC MAT CO LTD (CN)
CHANGZHOU TRONLY NEW ELECTRONIC MAT CO LTD (CN)
CHANGZHOU LEADER NEW ELECTRONIC MAT CO LTD (CN)
International Classes:
G03F7/004; C08F2/50; G03F7/037
Foreign References:
| JP2021155642A | 2021-10-07 | |||
| CN109666088A | 2019-04-23 | |||
| CN103819583A | 2014-05-28 | |||
| CN104076606A | 2014-10-01 | |||
| CN102459171A | 2012-05-16 | |||
| KR20200081810A | 2020-07-08 | |||
| US20180356729A1 | 2018-12-13 | |||
| JP2005099584A | 2005-04-14 |
Attorney, Agent or Firm:
KANGXIN PARTNERS , P.C. (CN)
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