Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN
Document Type and Number:
WIPO Patent Application WO/2021/153608
Kind Code:
A1
Abstract:
Provided are: a negative photosensitive resin composition with which high resolution properties are exhibited when a relief pattern is formed on copper wiring, imidization adequately progresses even when the curing temperature is low, and a cured relief pattern having good adhesion to copper wiring can be manufactured; and a method for manufacturing a cured relief pattern using the negative photosensitive resin composition. This negative photosensitive resin composition contains (A) a polyimide precursor including specific structural units which are represented by general formula (1) and which have a univalent organic group having a urea structure, and (B) a photopolymerization initiator.
Inventors:
FUJIOKA TAKANOBU (JP)
SHIMIZU TAKEKI (JP)
SHIMIZU TAKEKI (JP)
Application Number:
PCT/JP2021/002821
Publication Date:
August 05, 2021
Filing Date:
January 27, 2021
Export Citation:
Assignee:
ASAHI CHEMICAL IND (JP)
International Classes:
C08F290/14; C08G73/10; G03F7/004; G03F7/027; G03F7/20
Domestic Patent References:
| WO2017159876A1 | 2017-09-21 | |||
| WO2018123836A1 | 2018-07-05 | |||
| WO2018038001A1 | 2018-03-01 |
Foreign References:
| JP2004133435A | 2004-04-30 | |||
| JP2008050401A | 2008-03-06 | |||
| JP2011059656A | 2011-03-24 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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