Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR RESIN FILM HAVING PATTERN, RESIN FILM HAVING PATTERN, AND SEMICONDUCTOR CIRCUIT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2024/004462
Kind Code:
A1
Abstract:
A negative photosensitive resin composition comprising: a polymer (A); a crosslinking agent (B); and a photo-cation generator (C), wherein the polymer (A) has a structural unit represented by formula (a2) and has, at a terminal, a reactive group Y that reacts with the crosslinking agent (B) by the action of cations generated from the photo-cation generator (C) through light irradiation, and the photo-cation generator (C) includes a photo-cation generator (C1) that generates, through light irradiation, an acid having a pKa(1) of at least -3 and at most 3 as calculated using a Gaussian function based on the pKa of methanesulfonic acid in an aqueous solution of 25°C.
Inventors:
ITO HIROKAZU (JP)
OGAWA TAKU (JP)
ANDO MITSUKA (JP)
TATARA RYOJI (JP)
OGAWA TAKU (JP)
ANDO MITSUKA (JP)
TATARA RYOJI (JP)
Application Number:
PCT/JP2023/019497
Publication Date:
January 04, 2024
Filing Date:
May 25, 2023
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
G03F7/038; C08G65/40; C08G73/10; G03F7/004; G03F7/20
Domestic Patent References:
| WO2021039841A1 | 2021-03-04 | |||
| WO2021006181A1 | 2021-01-14 | |||
| WO2020021827A1 | 2020-01-30 |
Foreign References:
| JP2015031724A | 2015-02-16 | |||
| JP2001147527A | 2001-05-29 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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