Title:
NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE USING SAME
Document Type and Number:
WIPO Patent Application WO/2020/045311
Kind Code:
A1
Abstract:
The present invention is a negative photosensitive resin composition for film formation, the composition including an epoxy resin, a phenoxy resin, and a photoacid generator.
Inventors:
KOUSAKA MIKI (JP)
SUGIYAMA HIROMICHI (JP)
SUZUKI SAKIKO (JP)
SHIRAISHI RYOTA (JP)
SUGIYAMA HIROMICHI (JP)
SUZUKI SAKIKO (JP)
SHIRAISHI RYOTA (JP)
Application Number:
PCT/JP2019/033174
Publication Date:
March 05, 2020
Filing Date:
August 23, 2019
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
G03F7/038; C08K3/01; C08L63/00; C08L71/10; G03F7/004; G03F7/075
Foreign References:
| JP2017161881A | 2017-09-14 | |||
| JP2010230944A | 2010-10-14 | |||
| JP2015135522A | 2015-07-27 | |||
| JP2012215719A | 2012-11-08 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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