Title:
NICKEL-COATED COPPER FOIL AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2020/050331
Kind Code:
A1
Abstract:
Provided are: a nickel-coated copper foil suitable for mass production such that YAG laser welding can be used and electrical resistivity (volume resistivity) is reduced, by forming a nickel plating layer having a thickness of 0.5 µm or less on a surface of a copper foil by means of nickel plating; and a method for producing same. This nickel-coated copper foil has an overall thickness of 200 µm or less, and has a copper layer which comprises Cu or a Cu alloy and a nickel plating layer comprising Ni or a Ni alloy that covers the surface of the copper foil. The nickel plating layer has a thickness of 0.01-0.5 μm. The surface of the nickel plating layer has an a* value of 0-10 and a b* value of 0-14 in the L*a*b* color coordinate system determined by a SCI measurement method carried out in accordance with JIS Z 8722. The nickel-coated copper foil is obtained by subjecting a copper foil to a nickel plating treatment so that the nickel plating thickness is 0.01-0.5 μm, the a* value is 0-10 and the b* value is 0-14.
Inventors:
ASADA KEN (JP)
Application Number:
PCT/JP2019/034835
Publication Date:
March 12, 2020
Filing Date:
September 04, 2019
Export Citation:
Assignee:
HITACHI METALS LTD (JP)
International Classes:
C25D5/12; C25D7/06; C25D5/26; C25D5/50; H01B5/02; H01B13/00
Domestic Patent References:
| WO2018055884A1 | 2018-03-29 |
Foreign References:
| JP2016008343A | 2016-01-18 | |||
| JP2015209581A | 2015-11-24 | |||
| JP2011105960A | 2011-06-02 |
Other References:
TANIGUCHI, AKITOSHI: "Non-official translation: Latest plating technology-Consideration of mechanism and quality improvement", FIRST PRINTING, JOHOHIKO CO., LTD., 18 May 2006 (2006-05-18), pages 11
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