Title:
NICKEL COLLOID CATALYST SOLUTION FOR ELECTROLESS NICKEL OR NICKEL ALLOY PLATING, AND ELECTROLESS NICKEL OR NICKEL ALLOY PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/039016
Kind Code:
A1
Abstract:
After performing a preliminary adsorption promoting treatment by immersing a non-conductive substrate in a solution containing a surfactant, the non-conductive substrate is provided with a catalyst by means of a nickel colloid catalyst solution for electroless nickel plating, said nickel colloid catalyst solution containing (A) a soluble copper salt, (B) a reducing agent and (C) a colloid stabilizer, and electroless nickel plating is subsequently carried out. Since a catalyst is provided by means of a catalyst solution having excellent long-term stability after enhancing the catalytic activity by a preliminary treatment for promoting adsorption and the electroless plating is subsequently carried out, it becomes possible to obtain a uniform nickel coating film that is free from deposition unevenness. In cases where the present invention is applied to a nickel alloy plating method instead of the above-described nickel plating method, a nickel alloy coating film having excellent uniformity is able to be obtained.
Inventors:
UCHIDA EI (JP)
TANAKA KAORU (JP)
KAWABATA AI (JP)
TANAKA KAORU (JP)
KAWABATA AI (JP)
Application Number:
PCT/JP2015/070619
Publication Date:
March 17, 2016
Filing Date:
July 17, 2015
Export Citation:
Assignee:
ISHIHARA CHEMICAL CO LTD (JP)
International Classes:
C23C18/30; C23C18/32
Foreign References:
| JPH0293076A | 1990-04-03 | |||
| JP2007270344A | 2007-10-18 | |||
| JPH11209878A | 1999-08-03 | |||
| JPH03180476A | 1991-08-06 |
Attorney, Agent or Firm:
ISEKI, Katsumori et al. (JP)
Katsumori Iseki (JP)
Katsumori Iseki (JP)
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