Title:
NICKEL COLLOID CATALYST SOLUTION FOR ELECTROLESS NICKEL OR NICKEL ALLOY PLATING USE, ELECTROLESS NICKEL OR NICKEL ALLOY PLATING METHOD, AND METHOD FOR MANUFACTURING NICKEL- OR NICKEL-ALLOY-PLATED SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2021/261098
Kind Code:
A1
Abstract:
A uniform and even nickel or nickel alloy coating film is obtained by: bringing a non-conductive substrate into contact with a solution containing an adsorption enhancer comprising a surfactant to enhance the adsorption performance of the non-conductive substrate and thereby enhancing the catalytic activity of the non-conductive substrate; then applying a catalyst to the non-conductive substrate by using a nickel colloid catalyst solution for electroless nickel or nickel alloy plating use, said solution comprising (A) a soluble nickel salt, (B) a reducing agent, (C) a prescribed colloid stabilizer such as a polycarboxylic acid or an oxycarboxylic acid, and (D) a prescribed synthetic water-soluble polymer such as a polyvinylpyrrolidone or a polyethylenimine, and having excellent long-term stability; and then performing an electroless nickel or nickel alloy plating procedure.
Inventors:
TANAKA KOJI (JP)
SATOH ISSEI (JP)
OKUNO RYOSUKE (JP)
SATOH ISSEI (JP)
OKUNO RYOSUKE (JP)
Application Number:
PCT/JP2021/017916
Publication Date:
December 30, 2021
Filing Date:
May 11, 2021
Export Citation:
Assignee:
ISHIHARA CHEMICAL CO LTD (JP)
International Classes:
C23C18/30; C23C18/24
Foreign References:
| JP2016056421A | 2016-04-21 | |||
| JP2016151056A | 2016-08-22 | |||
| JPH0293076A | 1990-04-03 |
Attorney, Agent or Firm:
ISEKI Katsumori et al. (JP)
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