Title:
NON-CONTACT COMMUNICATION MEDIUM
Document Type and Number:
WIPO Patent Application WO/2023/132320
Kind Code:
A1
Abstract:
The present invention provides a non-contact communication medium (1) comprising an IC module (10) and a plurality of metal plates (20). Each of the plurality of metal plates (20) has a through-hole (21) and a slit (22). At least two metal plates (20) are laminated together, with an insulation layer (30) therebetween. The metal plates (20) include a first metal plate (20A) and a second metal plate (20B). The second metal plate (20B) is disposed across the slit (22) of the first metal plate (20A) in a plan view from the first metal plate (20A), and adds a capacitance across the slit (22) of the first metal plate (20A).
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| WO/2015/029726 | ELECTRONIC DEVICE |
| JP2004513464 | Non-contact data carrier |
Inventors:
KATAOKA SHIN (JP)
Application Number:
PCT/JP2022/048556
Publication Date:
July 13, 2023
Filing Date:
December 28, 2022
Export Citation:
Assignee:
TOPPAN INC (JP)
International Classes:
H01Q7/00; G06K19/077; H01Q1/38; H01Q1/50
Foreign References:
| US20180123221A1 | 2018-05-03 | |||
| JP2014075775A | 2014-04-24 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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