Title:
NON-THERMOPLASTIC POLYIMIDE FILM, MULTILAYER POLYIMIDE FILM, AND METAL-CLAD LAMINATED PLATE
Document Type and Number:
WIPO Patent Application WO/2023/162745
Kind Code:
A1
Abstract:
A polyamide acid according to the present invention has a tetracarboxylic acid dianhydride residue and a diamine residue. The tetracarboxylic acid dianhydride residue contains a 3, 3', 4, 4'-biphenyl tetracarboxylic acid dianydride residue and a 3, 3', 4, 4'-enzophenone tetracarboxylic acid anydride residue. The diamine residue contains a p-phenylenediamine residue and a 1, 3-bis(4-aminophenoxy)benzene residue. The multilayer polyimide film (10) has a non-thermoplastic polyimide film (11) and an adhesive layer (12) which is disposed on at least one face of the non-thermoplastic polyimide film (11) and which includes a thermoplastic polyimide.
Inventors:
SATO TAKAHIRO (JP)
OGUMA KEISUKE (JP)
OGUMA KEISUKE (JP)
Application Number:
PCT/JP2023/004721
Publication Date:
August 31, 2023
Filing Date:
February 13, 2023
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08G73/10; B32B27/34; C08J5/18
Domestic Patent References:
| WO2022085619A1 | 2022-04-28 |
Foreign References:
| JP2013544674A | 2013-12-19 |
Attorney, Agent or Firm:
HARUKA PATENT & TRADEMARK ATTORNEYS (JP)
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