NONPOROUS MOLDED ARTICLE FOR POLISHING LAYER, POLISHING PAD, AND POLISHING METHOD

Title:

NONPOROUS MOLDED ARTICLE FOR POLISHING LAYER, POLISHING PAD, AND POLISHING METHOD

Document Type and Number:

WIPO Patent Application WO/2016/067588

Kind Code:

A1

Abstract:

Provided is a nonporous molded article for a polishing layer which is a nonporous molded article of a thermoplastic polyurethane, wherein the thermoplastic polyurethane has a maximum loss tangent (tanδ) within a range of -70 to -50˚C of 4.00 x 10-2 or less. Preferably, the thermoplastic polyurethane is obtained by polymerization of a polymer diol having a number-average molecular weight of 650 to 1400, an organic diisocyanate, and a chain extender, and the thermoplastic polyurethane contains 5.7 to 6.5 mass% of nitrogen derived from the isocyanate groups in the organic diisocyanate.

Inventors:

KADOWAKI KIYOFUMI
KATO SHINYA
OKAMOTO CHIHIRO
KATO MITSURU
TAKEGOSHI MINORI

Application Number:

PCT/JP2015/005371

Publication Date:

May 06, 2016

Filing Date:

October 27, 2015

Export Citation:

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Assignee:

KURARAY CO (JP)

International Classes:

B24B37/24; B24B37/22; H01L21/304

Foreign References:

JP2005537946A	2005-12-15
JP2012529553A	2012-11-22
JP2008173760A	2008-07-31
JP2006231429A	2006-09-07

Other References: