NOVEL COMPOUND, POLYMER, AND RESIN COMPOSITION

WIPO Patent Application WO/2007/069640

A1

A radiation-sensitive resin composition which has high transparency to radiation, is excellent in basic properties required of resists, such as sensitivity, resolution, and pattern profile, especially in resolution performance, and is further excellent in DOF, LER, and resistance to immersion exposure; a polymer utilizable in the composition; a novel compound for use in synthesizing the polymer; and a process for producing the compound. The novel compound is represented by the following formula (1) and gives a radiation-sensitive resin composition having excellent resistance to immersion exposure. (1) In the formula (1), R1 represents methyl or hydrogen; R2, R3, and R4 each independently represents an optionally substituted, monovalent C1-10 organic group; n is an integer of 0-3; A represents methylene, linear or branched C2-10 alkylene, or arylene; and X- represents a counter ion for the S+.

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NAGAI TOMOKI
EBATA TAKUMA
MATSUMURA NOBUJI

PCT/JP2006/324836

June 21, 2007

December 13, 2006

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JSR CORP (JP)
NAGAI TOMOKI
EBATA TAKUMA
MATSUMURA NOBUJI

C07C381/12; C08F220/28; G03F7/004; G03F7/039; H01L21/027

JP2006259508A	2006-09-28
JP2006259509A	2006-09-28
JPH11279796A	1999-10-12
JPH02264756A	1990-10-29
JP2002201232A	2002-07-19
JP2002145955A	2002-05-22
JPH10221852A	1998-08-21
JPH09325497A	1997-12-16
JP2005084365A	2005-03-31
US5130392A	1992-07-14
JPH11176727A	1999-07-02
JPH0612452B2	1994-02-16
JPH05188598A	1993-07-30

See also references of EP 1961739A4

WAKI, Misao (Toin-cho Inabe-gun, Mie33, JP)

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